Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer screening for Show driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding reply to your demands of fine pitch, little pad measurement, superior speed, a lot less cleaning, multi-DUT, higher pin rely, and extremely-very low leakage requirements. With exceptional craftsmanship, ground breaking architecture and proven methodologies according to mechanical and electrical simulation/measurement final results, generating MPI the highest cantilever company around the globe.
FCB Probe Card
The FCB Probe Card is easily the most experienced technological know-how of buckling beam probe card. It is actually aimed to obtain the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) demand from customers. FCB is often a demonstrated Option for various semiconductor creation exams from early engineering pilot-runs to high quantity production (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or power integrity probing (PI). Purposes include things like slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the whole world’s ideal All round cost-of-possession (COO) for different DUT applications.
EVS Probe Card
The EVS Probe Card is really an enhancement over the traditional buckling beam probe card. Important options are increased present carrying ability (C.C.C.) and reduce well balanced Make contact with drive (BCF), along with overall MEMS-like features. EVS can easily satisfy the need of Superior wafer probing. Specific alignment and superb planarity Regulate would be the critical elements contributing to steady contact resistance. With its capability and effectiveness, EVS Probe Card is a perfect option for advanced probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Answer to need for at any time finer pitch. It is actually designed for more compact Al pad, and is particularly ideal for small pitch application with peripheral and whole array sample. With specific alignment and better planarity Handle, Osprey can get to better efficiency by multi-DUT style. The forming wire (FW) sort needle developed with MPI’s individual micro fabrication process not only delivers higher-top quality effectiveness but will also will allow easy needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of low force probing. It also comes website along with a chance to fulfill substantial C.C.C. and substantial pin counts application. The MEMS method guarantees extremely consistent needle characteristics, as well as Distinctive framework design and style enables specific alignment and planarity Regulate.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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